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CHRocodile 2 IT series optical sensors
    发布时间: 2019-02-26 17:51    

Non Contact Sensor measurement of wafer thickness during CMP, Backgrinding process. Wafer Warpage Measurement. Wire loop and bond height measurement in 3D packaging

 

 

Accurate high speed in process measurement of wafer thickness and warpage for Chemical mechanical polishing (CMP) and mechanical grinding process

 Wafer thickness range 20 – 980 um

Better reproducibility with area thickness monitoring

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