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CHRocodile Compact Line Sensor CLS-C
    发布时间: 2019-02-26 17:51    

Non Contact Sensor measurement of wafer thickness during CMP, Backgrinding process. Wafer Warpage Measurement. Wire loop and bond height measurement in 3D packaging

 

 

•2D and 3D Measurement of wire loop and bond height for 3D SiP packaging

•Records more than 1.13M pixel per sec @ rate of 6kHz

•Detailed high res 3D view of Solder bumps  and wire loops

•6 interchangeable probes scalable for measuring range from 200um to 4mm

•Easy integration in inspection machine

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